Bambu Lab H2C
革命性 Vortek 熱端自動換頭系統|專為專業列印與創新應用設計
Bambu Lab H2C 是 業界領先的多材料 3D 列印平台,配備 Vortek 熱端更換系統 與先進自動材料系統(AMS),
具備強大的多色、多材料列印能力與高度自動化流程,是專業工作室、教育機構與製造業的理想選擇。
這款機器將高速精密 FDM 列印與智能材料管理融合,提供極高穩定性與可靠性,不論是複雜原型製作或高效生產應用都能輕鬆勝任。
產品亮點
✔️ 自動化多材料 & 多色列印
搭載 Vortek 熱端更換系統:可在列印過程中快速、無縫切換熱端,不需人工干預。
AMS 自動材料系統支援最多多色多料組合,最大化列印效率與色彩自由。
✔️ 智能列印監控系統
內建 59 個感測器 + 四攝影機電腦視覺監控,搭配神經網路演算法提供即時迴饋與列印品質保障。
✔️ 強大列印能力
噴嘴最高溫度可達 350°C,能支援高性能工程材料列印。
主動加熱列印腔達 65°C,有助減少翹曲、提高層間附著強度。
✔️ 優秀安全與過濾設計
高效空氣過濾系統(含 HEPA 與活性碳層)抑制氣味與微粒;機箱阻燃設計提升使用安全性。
✔️ 全面連線與操作彈性
支援離線操作與雲端控制,方便遠端列印管理。高階模式亦可支援 MQTT 接入第三方整合方案。
誰適合 H2C?
專業產品開發者
需要打印高性能材料與複雜多色原型,並縮短開發迭代週期。
教育與研發單位
具備智慧監控與自動化功能,可作為先進製造教材或實驗資源。
列印工作室 & 小型製造
高速、準確與多材料列印能力助你提高產能與客戶滿意度。
常見問題
Q1:H2C 適合哪些用戶?
A:適合專業產品開發者、教育及研發單位、打印工作室及需要多色、多材料生產的小型製造商。
Q2:Vortek 熱端自動換頭系統有甚麼好處?
A:系統可在列印過程中自動更換熱端,減少人工換料及清理需要,適合多材料及支撐材料工作流程。
Q3:H2C 可以列印高性能材料嗎?
A:可以。H2C 具備最高 350°C 噴嘴及約 65°C 主動加熱腔體,可支援工程級材料及複雜原型製作。
Q4:H2C 是否適合大量多色列印?
A:適合。配合 AMS,可管理多種材料及顏色,並透過自動化流程提高工作室及小型生產的效率。
Q5:H2C 與 H2D Pro 應如何選擇?
A:如你重視多材料換頭及多色生產,H2C 是理想選擇;如你需要企業級網絡安全及更高階耐磨配置,則可考慮 H2D Pro。
Bambu Lab H2C - Technical specifications
Printing technology
Fused Deposition Modelling (FDM)
Body
| Forming volume (Width × Depth × Height) | Single nozzle left-side printing: 325×320×325 mm³ Single nozzle right-side printing: 305×320×325 mm³ Dual nozzle synchronous printing: 300×320×325 mm³ Dual nozzle total occupied space: 330×320×325 mm³ |
| Chassis | Aluminium and steel |
Outer frame | Plastic and glass |
Physical dimensions
| Body dimensions | 492*514*626 mm³ |
Net weight | 32.5 kg |
Nozzle
| Extruder gear | Hardened steel |
| Nozzle | Hardened steel |
| Maximum nozzle temperature | 350 °C |
| Applicable nozzle diameters | 0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm |
| Filament cutter | Built-in |
| Filament diameter | 1.75 mm |
Extruder motor | High-precision permanent magnet synchronous motor from Tuo Zhu Laboratory |
Heated platform
| Forming base material | Flexible steel plate |
| Random base plate type | Textured PEI sheet |
| Supported base plate types | Textured PEI sheet, engineering board |
| Maximum heated platform temperature | 120 °C |
Speed
| Maximum nozzle movement speed | 1000 mm/s |
| Maximum nozzle acceleration | 20,000 mm/s² |
| Maximum hot end flow rate | 40 mm³/s (Test conditions: single outer wall 250mm cylindrical model, Tuo Zhu ABS filament, printing temperature 280 °C) |
Chamber temperature control
| Active chamber heating | Support |
| Maximum Temperature | 65 °C |
Air Purification
| Pre-filter Grade | G3 |
| HEPA Filter Grade | H12 |
| Activated Carbon Filter Type | Granular Coconut Shell Carbon |
| Volatile Organic Compounds (VOC) Filtration | High Performance |
| Particulate Filtration | Support |
Cooling System
| Component Cooling Fan | Closed-loop Control |
| Hot End Cooling Fan | Closed-loop Control |
| Main Control Board Fan | Closed-loop Control |
| Chamber Exhaust Fan | Closed-loop Control |
| Chamber Heat Circulation Fan | Closed-loop Control |
| Auxiliary Component Cooling Fan | Closed-loop Control |
| Tool Head Enhanced Cooling Fan | Closed-loop Control |
Material Types
PLA, PETG, TPU, PVA, BVOH, ABS, ASA, PC, Nylon (PA), PET, PPS; Carbon Fiber / Glass Fiber Reinforced Materials: PLA, PETG, PA, PET, PC, ABS, ASA, PPA, PPS
Sensors
| Real-time Monitoring Camera | Built-in, 1920×1080 |
| Nozzle Monitoring Camera | Built-in, 1920×1080 |
| Panoramic Overhead Camera | Built-in, 3264×2448 (Laser-specific model equipped) |
| Nozzle Lens | Built-in, 1600×1200 |
| Door Sensor | Support |
| Material Outage Detection | Support |
| Material Entanglement Detection | Support |
| Material Length Measurement | Compatible with AMS Material System Support |
| Resume Printing After Power Outage | Support |
Power Requirements
| Input Voltage | 100-120 VAC / 200-240 VAC, 50/60 Hz |
| Maximum Power* | 1800 W@220 V/1250 W@110 V |
| Typical Operating Power | 200 W (220 V) / 200 W (110 V) (Single Nozzle Printing PLA) |
Operating Environment Temperature
10 °C-30 °C
Electronic Devices
| Touch Screen | 5 inch 720×1280 |
| Storage Device | Built-in 8GB eMMC + USB Port |
| Operating Interface | Touch Screen, Mobile App, Computer Software |
| Motion Control Chip | Dual-core Cortex-M4 + Single-core Cortex-M7 |
| Application Processor | Quad-core ARM (with built-in NPU Neural Network Processing Unit) |
Software
| Slicing software | Bambu Studio Third-party slicing software compatible with standard G-code export (such as Super Slicer, PrusaSlicer, Cura, etc.), some advanced features will not be available. |
| Supported operating systems | MacOS, Windows, Linux |
Network control
| Wired network | Not provided |
| Wireless network | Wi-Fi |
| Network emergency disconnect switch | Not provided |
| Removable network module | Not provided |
| 802.1X network access control | Not provided |
Wi-Fi
| Operating frequency band | FCC/CE certification specifications: 2412 – 2472 MHz, 5150 – 5850 MHz SRRC certification specifications: 2400 – 2483.5 MHz, 5150 – 5850 MHz |
| Wi-Fi transmission power (EIRP) | 2.4 GHz: FCC specification < 23 dBm; CE/SRRC/MIC specification < 20 dBm 5 GHz band 1/2: FCC/CE/SRRC/MIC specification < 23 dBm 5 GHz band 3: CE specification < 30 dBm; FCC specification < 24 dBm 5 GHz band 4: FCC/SRRC specification < 23 dBm; CE specification < 14 dBm |
| Wi-Fi transmission protocol | IEEE 802.11 a/b/g/n |